## Thermo Mems Homework Solutions

*Mechanical Engineering, Indian Institute of Science, Bangalore 560 012, India**Think big about small things!*

ME237 Introduction to MEMS Jan.-Apr. 2005

Instructor: G. K. Ananthasuresh, Room 106, ME Building, suresh at mecheng.iisc.ernet.in

Week | DatesTopicsRecitations | Notes | Assignments |

1 | Jan. 6: Glimpses of MEMS Jan. 7:Device examples: comb-drive, rate gyroscope, micromechanical filters | Glimpses of MEMS Feynman's papers (handed in class) | Homework #1 |

2 | Jan. 11: Basic scaling issues Jan. 13: Modeling and design of MEMS: the big picture Jan. 14: Silicon crystal orientations and anisotropy No class but see the crystal.pdf file and make it. | PisterCrystal.pdf | Homework #2 |

3 | Jan. 18: Microfabrication: the essentials Jan. 20: (contd.) Jan. 21: MUMPs, SUMMiT, and PennSOIL processes | Micromachining presentation Micromachining notes | Homework #3 |

4 | Jan. 25: Geometric design of MEMS Jan. 27: Lumped modeling of MEMS: mechanical aspects; Energy methods Jan. 28: Numerical problems | Review of beam theory (handout in the class). | Homework #4 |

5 | Feb. 1: Lumped modeling of multiple energy domains Feb. 3: (contd.) Feb. 4: No recitation class; please practise on CoventorWare solid modeling module. | A paper for motivating modeling of multiple domains | Homework #5 |

6 | Feb. 8: Modeling of electro-elasto statics: physics and lumped modeling Feb. 10: (contd.) Feb. 11: Numerical problems No class but reading material will be posted here. | Summary of lumped modeling | No homework this week; Practice CoventorWare solidmodeling module. |

7 | Feb. 15: Electro-elasto statics: distributed modeling Feb. 17: Coupled electro-elasto dynamics Feb. 18: FEA in Matlab for electrostatic MEMS | FEA notes | Homework #6 |

8 | Feb. 22: Squeezed film damping in MEMS Feb. 24: (Contd.) Feb. 25: Problems in Homework #6 | Old exam papers emstatic emdyn | No homework |

9 | Mar. 1: Numerical solution of nonlinear squeezed film equation Mar. 3: Review for midterm Mar. 4:Mid-term examination at 2 PM for one hour in the classroom | See solution to midterm2004 and homework solutions; and Circuit problems | |

10 | Mar. 10: Thermal modeling and lumped modeling of dissipative systems Mar. 11: Numerical problems | Notes | No homework |

11 | Mar. 15: Lumped modeling of dissipative systems Mar. 17: Thermal sensors and actuators, and their analysis Mar. 18: Finite element codes for electrostatic-elastodynamic analysis with damping | Notes | Homework #7 |

12 | Mar. 22: Optical MEMS Mar. 24: Bio and chemical MEMS Mar. 25: Micro PCR device: case study No class but reading material will be posted. | Notes | TBA |

13 | Mar. 29: Electronics issues in MEMS Mar. 31: Modeling of piezoelectric MEMS Apr. 1: Equivalent circuit simulation of MEMS in Simulink | Notes | Homework #8 |

14 | Apr. 5: Materials issues in MEMS Apr. 7: Packaging and reliability issues in MEMS Apr. 8: Discussion of the projects | Paper 1 Paper 2 | Homework #9 |

15 | Apr. 12: Project presentations | Notes | TBA |

16 | Apr. ?: Final Exam |

### EE245, Fall 2007

Introduction to MEMS Design

Tuesday and Thursday: 9:30 am - 11:00 pm

106 Moffitt Hall

NOTE: Effective Sept. 11^{th}, the class will meet in 3108 Etcheverry

Discussion Sections:

Section 101 - Friday, 1:00 to 2:00 pm, 293 Cory.

Section 102 - Friday, 4:00 to 5:00 pm, 293 Cory.

Prerequisite: Graduate standing in engineering or science; undergraduates with consent of instructor.

Note that the prerequisite requirement (or apparent lack of one) for this course reflects the fact that the course itself is meant to serve all engineering departments. this is not to say that no prior knowledge is required for this course; rather, it is more a statement that if you lack the necessary background knowledge, you will need to study and learn the material somewhat independently. In particular, although some of the background material will be covered in lecture, there is simply not enough time to do a thorough job of it. Thus, those less familiar with the material will need to turn to supplemmentary materials, such as the reference texts.

Note that this course will rely on concepts from numerous disciplines, from electrical engineering, to mechanical engineering, to materials science, to bioengineering. Thus, it is likely that nearly everyone will need to struggle with unfamiliar material at some point in the course.

Texts:

** Required: **

- S. Senturia,
*Microsystem Design,*2^{nd}Printing - Various material to be distributed throughout the course.

** Supplementry: **

- G. Kovacs,
*Micromachined Transducers Sourcebook* - Jaeger,
*Introduction to Microelectronic Fabrication (Vol. V of the Molecular Series on Solid State Devices),*2^{nd}Edition

** References: (on reserve) **

- C. Liu,
*Foundations of MEMS* - N. Maluf,
*An Introduction to Microelectromechanical Systems Engineering* - J. Pelesko & D. Bernstein,
*Modeling MEMS and NEMS*

Lecturer:

Professor Clark T. Nguyen

574 Cory Hall

Phone: (510) 642-6251

ctnguyen@eecs.berkeley.edu

**Office Hours:**

Tues., 1:30-3:00 pm, 574 Cory Hall

Thurs., 3:00-4:30 pm, 574 Cory Hall (to be modified in case of conflicts)

**Teaching Assistants:**

Li-Wen Hung

373 Cory Hall

lwhung@eecs.berkeley.edu

Office Hours: Monday, 9:00-10:00 am and 1:30-2:30 pm

382 Cory Hall

Yang Lin

linyang@eecs.berkeley.edu

Office Hours: Wednesday, 11:00-12:00 noon and 2:00-3:00 pm

382 Cory Hall

**Course Administrative Assistant:**

Rosita Alvarez-Croft

(510) 643-4976

rosita@eecs.berkeley.edu

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