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Thermo Mems Homework Solutions


Mechanical Engineering, Indian Institute of Science, Bangalore 560 012, India
Think big about small things!
ME237 Introduction to MEMS Jan.-Apr. 2005
Instructor: G. K. Ananthasuresh, Room 106, ME Building, suresh at mecheng.iisc.ernet.in

WeekDatesTopicsRecitationsNotesAssignments
1 Jan. 6: Glimpses of MEMS
Jan. 7:Device examples: comb-drive, rate gyroscope, micromechanical filters
Glimpses of MEMS
Feynman's papers (handed in class)
Homework #1
2 Jan. 11: Basic scaling issues
Jan. 13: Modeling and design of MEMS: the big picture
Jan. 14: Silicon crystal orientations and anisotropy No class but see the crystal.pdf file and make it.
PisterCrystal.pdf Homework #2
3 Jan. 18: Microfabrication: the essentials
Jan. 20: (contd.)
Jan. 21: MUMPs, SUMMiT, and PennSOIL processes
Micromachining presentation
Micromachining notes
Homework #3
4 Jan. 25: Geometric design of MEMS
Jan. 27: Lumped modeling of MEMS: mechanical aspects; Energy methods
Jan. 28: Numerical problems
Review of beam theory (handout in the class).Homework #4
5 Feb. 1: Lumped modeling of multiple energy domains
Feb. 3: (contd.)
Feb. 4: No recitation class; please practise on CoventorWare solid modeling module.
A paper for motivating modeling of multiple domainsHomework #5
6 Feb. 8: Modeling of electro-elasto statics: physics and lumped modeling
Feb. 10: (contd.)
Feb. 11: Numerical problems No class but reading material will be posted here.
Summary of lumped modeling No homework this week; Practice CoventorWare solidmodeling module.
7 Feb. 15: Electro-elasto statics: distributed modeling
Feb. 17: Coupled electro-elasto dynamics
Feb. 18: FEA in Matlab for electrostatic MEMS
FEA notes Homework #6
8 Feb. 22: Squeezed film damping in MEMS
Feb. 24: (Contd.)
Feb. 25: Problems in Homework #6
Old exam papers
emstatic
emdyn
No homework
9 Mar. 1: Numerical solution of nonlinear squeezed film equation
Mar. 3: Review for midterm
Mar. 4:Mid-term examination at 2 PM for one hour in the classroom
See solution to midterm2004 and homework solutions; and Circuit problems
10 Mar. 10: Thermal modeling and lumped modeling of dissipative systems
Mar. 11: Numerical problems
Notes No homework
11 Mar. 15: Lumped modeling of dissipative systems
Mar. 17: Thermal sensors and actuators, and their analysis
Mar. 18: Finite element codes for electrostatic-elastodynamic analysis with damping
NotesHomework #7
12 Mar. 22: Optical MEMS
Mar. 24: Bio and chemical MEMS
Mar. 25: Micro PCR device: case study No class but reading material will be posted.
Notes TBA
13 Mar. 29: Electronics issues in MEMS
Mar. 31: Modeling of piezoelectric MEMS
Apr. 1: Equivalent circuit simulation of MEMS in Simulink
NotesHomework #8
14 Apr. 5: Materials issues in MEMS
Apr. 7: Packaging and reliability issues in MEMS
Apr. 8: Discussion of the projects
Paper 1
Paper 2
Homework #9
15 Apr. 12: Project presentations Notes TBA
16 Apr. ?: Final Exam

EE245, Fall 2007
Introduction to MEMS Design

Tuesday and Thursday:  9:30 am - 11:00 pm
106 Moffitt Hall
NOTE:  Effective Sept. 11th, the class will meet in 3108 Etcheverry

Discussion Sections:
Section 101 - Friday, 1:00 to 2:00 pm, 293 Cory.
Section 102 - Friday, 4:00 to 5:00 pm, 293 Cory.

Prerequisite:  Graduate standing in engineering or science; undergraduates with consent of instructor.

Note that the prerequisite requirement (or apparent lack of one) for this course reflects the fact that the course itself is meant to serve all engineering departments.  this is not to say that no prior knowledge is required for this course; rather, it is more a statement that if you lack the necessary background knowledge, you will need to study and learn the material somewhat independently.   In particular, although some of the background material will be covered in lecture, there is simply not enough time to do a thorough job of it.   Thus, those less familiar with the material will need to turn to supplemmentary materials, such as the reference texts.

Note that this course will rely on concepts from numerous disciplines, from electrical engineering, to mechanical engineering, to materials science, to bioengineering.   Thus, it is likely that nearly everyone will need to struggle with unfamiliar material at some point in the course.

Texts:

Required:

  • S. Senturia,  Microsystem Design, 2nd Printing
  • Various material to be distributed throughout the course.

Supplementry:

  • G. Kovacs,  Micromachined Transducers Sourcebook
  • Jaeger,  Introduction to Microelectronic Fabrication (Vol. V of the Molecular Series on Solid State Devices), 2nd Edition

References:  (on reserve)

  • C. Liu,  Foundations of MEMS
  • N. Maluf,  An Introduction to Microelectromechanical Systems Engineering
  • J. Pelesko & D. Bernstein,  Modeling MEMS and NEMS

Lecturer:
Professor Clark T. Nguyen
574 Cory Hall
Phone: (510) 642-6251
ctnguyen@eecs.berkeley.edu

Office Hours:
Tues., 1:30-3:00 pm, 574 Cory Hall
Thurs., 3:00-4:30 pm, 574 Cory Hall (to be modified in case of conflicts)

Teaching Assistants:

Li-Wen Hung
373 Cory Hall
lwhung@eecs.berkeley.edu
Office Hours:  Monday, 9:00-10:00 am and 1:30-2:30 pm
382 Cory Hall

Yang Lin
linyang@eecs.berkeley.edu
Office Hours:  Wednesday, 11:00-12:00 noon and 2:00-3:00 pm
382 Cory Hall

Course Administrative Assistant:
Rosita Alvarez-Croft
(510) 643-4976
rosita@eecs.berkeley.edu

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